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| GaAs Millimeter Wave/Sub-Millimeter Wave Schottky Diodes |
Teledyne Scientific Company offers a wide variety of millimeter-wave and submillimeter-wave planar airbridged Schottky diodes for applications in the 10 GHz to over 2.5 THz range.
Unique Diode Properties
- Junction capacitance as low as 2fF allowing cutoff frequency >2THz
- Very low parasitic capacitance < 9fF
- Ultra low series resistance < 3Ω
- Airbridged anode contact for low parasitic operation
- Fully passivated by SiN
- Flip chip and beamlead geometry
- Space qualifiable construction
- MMIC backend process available for integrated passives and vias
- Unique gold stand-off platforms for ruggedness in flip-chip applications
GaAs Schottky Diode Products
Single |
|
Part No.
Data Sheet (PDF) |
VF @ 1mA
(mV) |
CJunction |
CTotal |
VR @ -5uA |
Geometry |
Chip Dimension
(GaAs only) |
| TSC-S-01020 |
730-950 |
1.1 fF |
18 fF |
-5V min |
FlipChip |
14mil x 5.1mil |
| TSC-S-02020 |
700-850 |
4.3 fF |
23 fF |
-5V min |
FlipChip |
| TSC-S-03020 |
700-850 |
9.8 fF |
30 fF |
-5V min |
FlipChip |
| TSC-S-04020 |
650-800 |
17 fF |
40 fF |
-5V min |
FlipChip |
| TSC-SB-01020 |
730-950 |
1.1 fF |
18 fF |
-5V min |
Beamlead |
14mil x 5.1mil
|
| TSC-SB-02020 |
700-850 |
4.3 fF |
23 fF |
-5V min |
Beamlead |
| TSC-SB-03020 |
700-850 |
9.8 fF |
30 fF |
-5V min |
Beamlead |
| TSC-SB-04020 |
650-800 |
17 fF |
40 fF |
-5V min |
Beamlead |
Antiparallel |
|
Part No.
Data Sheet (PDF) |
VF @ 1mA
(mV) |
CJunction* |
CTotal** |
VR @ -5uA |
Geometry |
Chip Dimension
(GaAs only) |
| TSC-AP-02020 |
700-850 |
4.3 fF |
23 fF |
-5V min |
FlipChip |
14mil x 5.1mil
|
| TSC-AP-03020 |
700-850 |
9.8 fF |
30 fF |
-5V min |
FlipChip |
| TSC-AP-04020 |
650-800 |
17 fF |
40 fF |
-5V min |
FlipChip |
| TSC-APB-02020 |
700-850 |
4.3 fF |
23 fF |
-5V min |
Beamlead |
14mil x 5.1mil
|
| TSC-APB-03020 |
700-850 |
9.8 fF |
30 fF |
-5V min |
Beamlead |
| TSC-APB-04020 |
650-800 |
17 fF |
40 fF |
-5V min |
Beamlead |
*Single Junction
**Single Capacitance
TEE |
|
Part No.
Data Sheet (PDF) |
VF @ 1mA
(mV) |
CJunction |
CTotal |
VR @ -5uA |
Geometry |
Chip Dimension |
| TSC-T-01025 |
730-950 |
1.1 fF |
18 fF |
-5V min |
FlipChip |
22.2mil x 5.1mil |
| TSC-T-02025 |
700-850 |
4.3 fF |
23 fF |
-5V min |
FlipChip |
Inverted-TEE |
|
Part No.
Data Sheet (PDF) |
VF @ 1mA
(mV) |
CJunction |
CTotal |
VR @ -5uA |
Geometry |
Chip Dimension |
| TSC-IT-01025 |
730-950 |
1.1 fF |
18 fF |
-5V min |
FlipChip |
22.2mil x 5.1mil
|
| TSC-IT-02025 |
700-850 |
4.3 fF |
23 fF |
-5V min |
FlipChip |
Small Profile
Single/Antiparallel |
|
Part No.
Data Sheet (PDF) |
VF @ 1mA
(mV) |
CJunction |
CTotal |
VR @ -5uA |
Geometry |
Chip Dimension |
| TSC-SS-0112 |
730-950 |
1.1 fF |
14 fF |
-5V min |
FlipChip-Single |
5mil x 3mil |
| TSC-SAP-0109 |
700-950 |
1.1 fF* |
14 fF** |
-5V min |
FlipChip-Antiparallel |
5mil x 3mil |
*Single Junction
**Single Capacitance
Square Shapped
Single |
|
Part No.
Data Sheet (PDF) |
VF @ 1mA
(mV) |
CJunction |
CTotal |
VR @ -5uA |
Geometry |
Chip Dimension
|
| TSC-SSS-05425 |
660-750 |
23 fF |
64 fF |
-5V min |
FlipChip |
11.3mil x 11.3mil |
| TSC-SSS-06225 |
660-750 |
30 fF |
75 fF |
-5V min |
FlipChip |
| TSC-SSS-07025 |
660-750 |
39 fF |
87 fF |
-5V min |
FlipChip |
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