Teledyne Imaging Sensors delivers standard and custom imaging subsystems. This includes packaged focal plane arrays incorporating optics, coolers, or board electronics – to satisfy customer specified requirements such as mechanical, optical, thermal, and electrical interface.

In a soon to be offered product, Teledyne Imaging Sensors developed an FPA support Application Specific Integrated Circuit (ASIC), which provides clock and bias generation for FPA operation, and image processing – gain and offset correction and analog-to-digital conversion. This ASIC can replace multiple boards of support electronics, leading to compact imaging subsystems.